PRODUCTS
Optical Communication Applicat
-
Active Component Manufacturing
- Optical LD & PD Wafer
- Aspherical Lens and Cap
- TEC Device
- 2.5G-10G APD CHIP
- 10G PIN PD CHIP
- Transimpedance Amplifier
- Aluminum Nitride Substrates
- Alumina substrates
- High Temperature Co-fired Substrates (HTCC)
- 10G CWDM DFB Chip
- Microlens Array
- Smile Corrector
- Slow Axis Collimators(SAC)
- Fast Axis Collimators Arrays(FACA)
- MEMS Mirror
- SOI Wafers
- Super-thick Thermal Oxidized Wafers
- 25G DFB Laser Diode Chip
-
Test and Measurement
-
High Speed Qptical Transceiver
-
Optical Transport Network Devi
-
Network, Security and Delivery
-
Optical Automation Equipments
-
Passive Component Manufacturin
Industrial Laser and Optical A
-
Lasers
-
Laser Drivers
-
Controller Electronics
-
Optical Components
-
Materials
Solutions
-
BOSA Manufacturing and Packagi
-
ECDL Stable Laser Solution
-
Laser Spectroscopy Solution
Aluminum Nitride Substrates
Features
■ High thermal conductivity (170-230W/mK), up to 9.5 times than that of Alumina
■ Similar coefficient of thermal expansion to that of silicon (Si). This helps to achieve high reliability of Si chip and thermal heat cycling
■ Higher electric insulation, and Smaller dielectric constant
■ Higher mechanical strength (450MPa).
■ Superior corrosion resistance against molten metal.
■ Very high purity, no toxicity.
Applications
Heat dissipation substrate, LED package, Power module, Wafer bonding, Power resistor.
*Various metalized processing is available (Thin film, Thick film, DBC, AMB, DPC, etc.).
Supplier
![](/d/file/content/2017/06/5934ce9474d88.jpg)
MARUWA established an integrated production system from ceramic substrates and machined substrates to electronic components or devices, so as to be responsive to the market needs. We are on a mid-way of further integrating our technical capabilities and keep on polishing our general technologies from ceramics to circuit designing and packaging.