PRODUCTS
Optical Communication Applicat
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Active Component Manufacturing
- Optical LD & PD Wafer
- Aspherical Lens and Cap
- TEC Device
- 2.5G-10G APD CHIP
- 10G PIN PD CHIP
- Transimpedance Amplifier
- Aluminum Nitride Substrates
- Alumina substrates
- High Temperature Co-fired Substrates (HTCC)
- 10G CWDM DFB Chip
- Microlens Array
- Smile Corrector
- Slow Axis Collimators(SAC)
- Fast Axis Collimators Arrays(FACA)
- MEMS Mirror
- SOI Wafers
- Super-thick Thermal Oxidized Wafers
- 25G DFB Laser Diode Chip
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Test and Measurement
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High Speed Qptical Transceiver
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Optical Transport Network Devi
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Network, Security and Delivery
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Optical Automation Equipments
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Passive Component Manufacturin
Industrial Laser and Optical A
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Lasers
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Laser Drivers
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Controller Electronics
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Optical Components
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Materials
Solutions
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BOSA Manufacturing and Packagi
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ECDL Stable Laser Solution
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Laser Spectroscopy Solution
Alumina substrates
Features
■ Good smoothness / flatness with less porosity. Excellent in adhesion with thin film and thick film materials.
■ Less variance in outline, plate thickness, slit pitch, etc.
■ Minimal warpage, bending, and undulation.
■ Physical and chemical properties are stable even under a hot environment. Excellent in thermal shock resistance. High thermal conductivity and coefficient of thermal expansion similar to that of silicon.
■ High mechanical strength.
■ Excellent resistance against oil and chemical.
■ Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and small dielectric constant.
■ Stable breaking strength, and less variance in shape or dimensions.
Applications
LED packages, Substrate for chip resistors, HIC substrates for heat dissipation, Power modules, FAX substrates for thermal printer head
*Various processing is available (thin film metalization, thick film metalization, glaze, etc.)
Supplier
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MARUWA established an integrated production system from ceramic substrates and machined substrates to electronic components or devices, so as to be responsive to the market needs. We are on a mid-way of further integrating our technical capabilities and keep on polishing our general technologies from ceramics to circuit designing and packaging.