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Alumina substrates
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Product Introduction

 

Alumina substrates

 

Features

■ Good smoothness / flatness with less porosity. Excellent in adhesion with thin film and thick film materials.

■ Less variance in outline, plate thickness, slit pitch, etc.

■ Minimal warpage, bending, and undulation.

■ Physical and chemical properties are stable even under a hot environment.  Excellent in thermal shock resistance. High thermal conductivity and coefficient of thermal expansion similar to that of silicon.

■ High mechanical strength.

■ Excellent resistance against oil and chemical.

■ Excellent in insulation properties, high dielectric breakdown voltage, high surface resistivity / volume resistivity, and small dielectric constant.

■ Stable breaking strength, and less variance in shape or dimensions.

 

Applications

LED packages, Substrate for chip resistors, HIC substrates for heat dissipation, Power modules, FAX substrates for thermal printer head

*Various processing is available (thin film metalization, thick film metalization, glaze, etc.)

Supplier

MARUWA established an integrated production system from ceramic substrates and machined substrates to electronic components or devices, so as to be responsive to the market needs. We are on a mid-way of further integrating our technical capabilities and keep on polishing our general technologies from ceramics to circuit designing and packaging.

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