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High Temperature Co-fired Substrates (HTCC)
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Product Introduction

 

High Temperature Co-fired Substrates (HTCC)

Features

This product achieves a variety of products with high reliability, high density, and multifunction. It is used in ceramic heater, optical/power element package, and sensor package. 

 

Applications

Ceramic heater, Optical communication package, LED package, Sensor package, SMD package, Hybrid IC with power line, Compact module replacing mother board, MEMS (Micro Electro Mechanical Systems) package. 

Supplier

MARUWA established an integrated production system from ceramic substrates and machined substrates to electronic components or devices, so as to be responsive to the market needs. We are on a mid-way of further integrating our technical capabilities and keep on polishing our general technologies from ceramics to circuit designing and packaging.

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